Usually, discoveries in laboratories hit the market after many years of pushing a new, even revolutionary solution. In the era of more and more powerful logic circuits that require more and more energy and thus generate more and more heat, we very much hope that this new method of cooling electronics will hit the market sooner rather than later.
Scientists have developed a new way of cooling electronics
In the pages of Nature Electronics An article by scientists from the University of California at Berkeley and the University of Illinois was published, the use of which, purely theoretically, would provide even a 740% increase in the efficiency of the systems. The project focuses on solving three main problems (according to the researchers) – the high cost of the systems, the complete lack of cooling of the underside and the lack of direct contact between the cooling and the silicon.
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Solution? The logic is completely covered with copper, which provides protection and excellent thermal conductivity. Surprisingly, its cooling efficiency (we are interested in the issue of heat dissipation) has abandoned the requirement to use not only a thermoplastic, but even the heat sink itself. This supposedly provides up to 740% increase in computing power (depending on the system), but we have the impression that in this form it will never hit the field of GPU or CPU, and more so of microcircuits.
