A post on Reddit revealed the first photograph of an AMD EPYC Genoa processor, confirming what these new next-gen CPUs will look like, which will be incredibly large to accommodate a total of up to 12 CPU DIEs, that is, up to 96 cores. and 192 threads.
The EPYC Genoa processors will be based on Zen 4 and will mark the debut of the new SP5 socket, also known as the LGA-6096. Hosting these 6096 pins clearly takes a lot of space, and as we can see, the CPU will take up practically the size of the palm of a hand or even more.
Other features of this new platform will include support for 12 channels of DDR5-5200 memory, 128 PCI-E 5.0 lanes in single-CPU configuration or 160 in dual-CPU configuration, and TDPs of up to 400W per processor, having to cool a total of 800W only on processors on dual-CPU platforms.
It will be interesting to see the heatsinks that will be used for these CPUs, as the contact area is just huge. Efficiently removing heat from such a large area will not be easy, so the design of these heatsinks will be more than striking. Given that these processors will arrive only at the end of 2022, there is still enough to know more details about them, so we will have to wait a little longer to see how much they perform and what cooling solutions are used. We will keep you updated on the news, so stay tuned to HD Tecnología.