China already has 128-layer QLC 3D NAND Flash for SSD

We cannot say that we are unfortunately surprised by the progress of a company like Yangtze in the world of NAND Flash. We had talked several times about how China's boom was unstoppable and how the rest of the giants in the sector couldn't seem to keep up.

Not even Samsung, the leader so far in this field, seems to be able to press the accelerator against its new rival.

The SSDs and RAMs of the future will integrate Chinese chips

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<p>If we can get something clear from the presentation of the new X2-6070 chips based on 128-layer NAND Flash 3D QLC with 1.33 Tb capacity, it is that Yangtze is here to stay. Its Xtacking architecture is proving more advanced and competitive than that of its rivals, and they already have in mind 128 and 512 Gb TLC chips through their new X2-9060.</p>
<p>We are talking about a meteoric race that was conceived in 2018 and that after only two years of production can already manufacture chips of this caliber with speeds of up to 3 Gbps of I / O.</p>
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Although these speeds are reserved for more specific chips, YMTC has revealed that these two new chips X2-6070 and X2-9060 offer 1.6 Gbps and operate at a voltage of just 1.2V.

This allows them to enter the consumer market with all the guarantees to compete against the rest of the manufacturers and even for capacity they can already offer their products to companies that are dedicated to cloud storage.

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China does not stop here and will continue to push towards PLC

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The 128 layers in QLC are just the first step for YMTC. As we well know, the company is part of the Tsinghua Unigroup, for which it receives "aid" from the government and where curiously they are producing these chips in Wuham, specifically at the XMC factory, a company that the group absorbed in order to acquire both patents, facilities and technology.

The "nationalization" meant that YMTC had at its disposal one of the largest semiconductor manufacturing plants in all of China and, oddly enough, already working with Xtacking architecture.

These chips X2-6070 with 336 billion memory cells and 4 bits per cell They are ready for mass production, and although the company has not specified which drivers will support its chips, it is more than likely that if unit prices are low, it will be the assemblers themselves who will knock on YMTC's door.

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Unfortunately, this is but one example of the many where China is spreading its companies and, above all, its technology in silence and throughout the world. Not surprisingly, it has different fronts open with the US as with Huawei and the next one is expected to be somehow Xiaomi. We will see how it affects that YMTC ends up taking over a key sector such as NAND Flash and what will be the response of the United States and the European Union to this challenge.


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