TSMC’s plans for the coming years. When is the 2- and 3-nm technological process?

TSMC is currently the largest manufacturer of semiconductor systems in the world, whose production technologies are already believed by Intel, AMD and NVIDIA. No wonder, because over the years it has become a giant in this segment and has no intention of resting on its laurels. TSMC’s plans for the coming years confirm this as it goes into details of the next “nanometer levels”.

More and more advanced technological processes, i.e. TSMC’s plans for the coming years

The lower the process, the more transistors can be packed into a given silicon chip and thus the higher the efficiency. Obviously, this is not “free performance”, but comes at the expense of having to deal with higher voltage and temperature. Currently, the most popular process in mainstream equipment is the 7-nm, soon 5-nm will fight for this name, and with time also 3- and 2-nm.

According to the latest information on TSMC’s plans, the so-called “tape-out”, ie the first 3-nm chips from the production lines, is to take place at the end of this year. The next step, the 2nm process that will introduce the new GAA (Gate All Around) transistors to increase performance, is still on track to go into series production in 2025. In his case, the “tape-out” is to take place in 2024.

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Answering investors’ questions during a phone call regarding TSMC’s financial results for the first quarter of 2022, the company’s CEO confirmed that the company’s upcoming production processes were running smoothly.