Will AMD once again rely on ASMedia for the X670 chipset?

The X570 chipset presented together with the Ryzen 3000 CPUs was designed by AMD, unlike the previous solutions (B350, B450, X370, X470) designed by ASMedia. According to the latest rumors, again will be a “third party” to take care of the design of the future chipset, the hypothetical X670, which will accompany the next generation Ryzen.

According to the Chinese site MyDrivers, the 600 series chipset range will probably be re-designed by ASMedia. It cannot be excluded that another company is selected, but given ASMedia’s previous relationships and capabilities, there is a good chance that she will take care of it.

X670 will retain – and could not be otherwise – the PCI Express 4.0 connectivity that already characterizes X570. One of the aspects that will likely be worked on will be i consumption and the heat generated: the goal should be to return to offer again passive cooling for the chipset, today more unique than rare on the X570.

Another element the design will probably focus on is making the chipset cheaper. The possible loss of the cooling fan will also play a role in this sense, lowering the list of motherboards compared to the current X570 proposals. Among other things, by diverting the design externally, AMD will be able to shift the attention of the research and development division to more important issues.

As for the timing of arrival of the new platform, there are no certainties at the moment. MyDrivers speaks of the end of next year, which would imply the release of the Ryzen 4000 in the same period. However, AMD is likely to retain the third quarter as the new CPU series release period, with announcement at Computex in June and debut in subsequent weeks. Obviously we will inform you as soon as we have official news.