Not many people really understand Toshiba's movement, given that fame and reputation are theirs as inventors of NAND Flash memory, and being pioneers in DRAM technology and other forms of solid-state devices. Toshiba maintains the hard drive division, but the part of SSDs has been totally left by Kioxia, which began operations in the last quarter of last year, inheriting the Toshiba catalog.
In this CES 2020, the brand has made its debut, but it is not that it has shown a lot of news but rather the rebranding of products that Toshiba already had in the market. Of course, we must highlight the presentation of an NVMe SSD with a capacity of 30 TB, which is no small matter. Let's see everything.
On the one hand we have the models CD6, designed for data centers and that come in capacities from 800 GB to 15 TB. They use the next-generation U.3 connector (SFF-TA-1001) with physical PCI-Express 4.0 x4 interface and NVMe 1.4 protocol. They stand out for their SIE, FIPS140-2 and SED Opal / Ruby security technologies. Note that despite its interface and connector, they are manufactured in standard 2.5-inch format.
CM6 is the cousin-brother of CD6, also oriented to companies but more for critical servers that need high availability. In this case, they stand out for providing capabilities from 800 GB to 30 TB, with quite striking performance data: up to 6,400 MB / s speed transfer. Like the previous ones, they make use of PCI-Express 4.0 x4 interface with NVMe 1.4 and its connector is U.3.
To end with business-oriented devices, we find the XD5 that come in the same form factor as the previous ones but also in M.2 format. In this case it is a mere rebranding of the Toshiba XD5 that they already had before in the market.
The firm has also shown its SSDs oriented to the consumer market at CES 2020, again consisting of a rebranding of the Toshiba XG6 and XG6-P that they already had in the market, but now with the brand new logo.
These SSDs come only in M.2 format with PCI-Express 3.0 interface and NVMe 1.2 protocol, with speeds up to 3,180 MB / s read and manufactured with 3-layer NAND BiCS FLASH 3D TLC memory chips.
At the moment the manufacturer has not indicated release dates or prices, so as always, we will have to wait for the CES to finish to know this information.
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