SLC memories from SkyHigh Memory already in 1 xnm technological process

SkyHigh Memory will expand its offer of NAND SLC memory, which is the current White Crow on the semiconductor disk market, with three new chips with different capacities. The first two of the largest are already available for testing and sampling by third parties, and the third is due in January 2022.

Production of SLC from SkyHigh Memory on 1 xnm process has started

I am talking about 4-, 2 and 1-gigabit ML-3 chips of SLC NAND Flash SPI memory, which will be produced using the most advanced technology in this sector, i.e. 1 xnm. These third-generation memories will be designed to work with various interfaces and will complement the company’s current offer, including similar chips, but in the form of 4-16 GB memory.

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These less capacious NANDs are designed to support high-reliability systems that store critical data and operate in an environment with high temperatures, over 105 degrees Celsius. They have their own ECC error prevention engine, various security features and offer up to 1 Mb of OTP deck, which is the most capacious SLC on the market.

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Overall, the entire SPI SLC NAND family from SkyHigh Memory is part of the first generation SLC NAND memory with a serial interface. They are sold in the form of an 8-pin LGA housing (6mm x 8mm), which saves space on the board and simplifies its board layout.