G.Skill, DDR4-3200 low latency kit up to 256 GB on arrival

G.Skill, DDR4-3200 low latency kit up to 256 GB on arrival

G.Skill announced a new one 32 GB DDR4-3200 CL14-18-18-38 memory module (based on a 16 Gbit density chip) which will expand the Trident Z RGB, Trident Z Royal and Trident Z Neo lines. There will be 256 GB (32 GB x 8), 128 GB (32 GB x 4) and 64 GB (32 GB x 2) kits for quad-channel and dual-channel platforms.

The 256 GB kit is intended for the latest Intel and AMD HEDT platforms. G.Skill tested this proposal on an Asus ROG Rampage VI Extreme Encore platform with an Intel Core i9-10900X CPU and on an MSI Creator X299 motherboard with a Core i9-10940X processor.

The company will also bring this kit to the Trident Z Neo series and to demonstrate this it has released screenshots in which the memories work without problems on an Asus ROG Zenith II Extreme (TRX40) with a Ryzen Threadripper 3960X.

However, the Trident Z Neo line also looks at AMD’s X570 platform thanks to the 128 GB (32 GB x 4) and 64 GB (32 GB x 2) solutions: these memories could be an excellent match for configurations with Ryzen 9 3900X or 3950X, even if G.Skill has validated the kit on a platform Asus Prime X570-P with Ryzen 5 3600.

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All kits support the Intel XMP 2.0 profile to facilitate overclocking and will be available during the first quarter of 2020 at prices still to be determined.


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