Intel plans Xe graphics card with chiplet and 500 W power budget

Recent data and leaks surrounding Intel’s Xe architecture have focused on integer models, where Gen12 graphics in laptops have been interspersed with the closely related Intel DG1 developer card. However, the company is planning significantly more potent solutions, which is revealed in a presentation revealed by Digital Trends.

The presentation confirms the code name Arctic Sound and graphics cards consisting of up to four circuits. These are integrated on the same substrate, so-called Multi-Chip Module (MCM), with Intel’s Foveros technology. The presentation mentions several different levels, where the basic level only applies one layer corresponding to the capacity in DG1.

The most advanced configuration thus integrates circuits into one package. If a warehouse meets the specifications of DG1, such a card is equipped with four times 512 EU units (Execution Unit), which gives a total of 4,096 calculation units as each EU unit is equipped with eight calculation units. The circuit also has a large power budget of 500 W.

The presentation also mentions that Arctic Sound applies graphics memory of the type HBM2e, which is primarily focused on data centers. The power budget of 500 W and power supply of 48 V are not supported in consumer products that use 12 V, which suggests that the variant with four circuits is therefore probably specially designed for data centers.

Further images from the leaked presentation show three more configurations in the Arctic Sound lineup. These include a circuit with 128 EU units and 75 or 150 W power budget as well as a configuration with two layers of 256 EU units and 300 W power budget.

Intel’s first dedicated graphics card with Xe architecture will be launched in 2020, with previous reports announcing a launch this summer. It remains to be seen how many layers the first consumer products will offer.

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