Meteor Lake CPUs would combine Intel’s 7nm with TSMC’s 5nm and 3nm

Meteor Lake CPUs will combine three different DIEs on a single chip, and it appears that each of these DIEs will be manufactured under a different process. According to the latest rumors, the CPU DIE will be manufactured by Intel under its Intel 4 (7nm) process, the I / O DIE (SOC-LP) will be manufactured under the TSMC 5nm process, and the GPU DIE will be manufactured. under TSMC’s 3nm process to put a large number of GPU cores in a small space.

The packaging of these CPUs will be carried out with Intel’s new Foveros technology, responsible for interconnecting all these DIEs to work together. The company is already testing the first Meteor Lake prototypes to make sure this packaging process works well, and as announced by the company itself, it has already succeeded in lighting the first chips, an important stage in the design and manufacturing process of the Meteor Lake. chip.

Meteor Lake will be the 14th. generation of Intel Core processors and will support PCI-E 5.0, DDR5, and some rumors indicate that the desktop would be compatible with LGA 1700, although most likely it will use the future LGA 18XX socket. Their production will only begin in mid-2023, so we will not see them on the market until the end of that year, although it is good to know that Intel already has everything on track to launch them on that date and avoid delays.

What do you think about this innovative Meteor Lake design that separates CPU, GPU and I / O into three separate DIEs? Do you think it will be the future of processors?

Source: WCCFTech