Samsung is shifting the pace of production of HBM2 memory

The HBM memory technology has been on the market since 2015, but has so far been used in high-performance cards for enthusiasts or expensive calculation cards. A major obstacle has been high prices and low capacities, while competition from more traditional technologies such as GDDR5X and now approaching GDDR6 has been fierce.

Samsung now announces that the company is increasing the production of their 8 GB HBM2 memory. The memory consists of eight stacked 8 Gbit HBM2 circuits, all of which are connected vertically by technology through-silicon via (TSV). Furthermore, a bandwidth of up to 256 GB / s per capsule is stated, depending on the clock frequency.

Increased volume production gives so-called economies of scale, which can drive down manufacturing costs. In addition to this, Samsung points to additional advantages, where fewer memory capsules also means lower power consumption as well as lower prices for the same amount of memory.

The increase in production will take place over time to meet market demand. Samsung estimates that the production of 8 GB circuits will account for 50 percent of the company’s HBM2 production during the first half of 2018.