TSMC reveals that its 3nm process will allow the placement of 250 million transistors per mm2

Although the first products based on TSMC's 5nm process are still a few months away from the market, the semiconductor giant already has everything practically ready for its 3nm process, and revealed several characteristics of it.

The most surprising fact is without a doubt the capacity to place 250 million transistors in a single square millimeter. To magnify this, a Core 2 Duo would fit in a single mm2, or we could even place a Ryzen 7 2700x in just 20 square millimeters, that is, a DIE of less than half a centimeter by half a centimeter.

Other important data is the confirmation of the start of its mass production in 2022 with risky production in 2021, and its consumption and performance benefits, which include 15% more performance at the same power, or 25 to 30% less consumption at the same performance versus at 5nm.

What do you think about these impressive figures from TSMC's 3nm process?

Source: TechPowerUp