AMD Instinct MI300, the future CDNA 3 accelerator will have up to 8 Compute Die?

AMD has fully embraced the path of modular projectsfirst with CPUs and more recently with accelerators for datacenters, where the Instinct MI250 and MI250X solutions represent the first project MCM (multi-chip module) based on absolute GPU. The approach, according to rumors, will be resumed for desktop video cards based on RDNA 3 architecture arriving in the second half of the year.

The plans of the US company would seem to foresee an increasing use of this approach, with the unbundling of certain functions in single dies joined together through some packaging techniques to act in concert. With the next generation of accelerators Instinct MI300 we could see a further one evolution of the conceptat least according to the rumors of “Moore’s Law is Dead”.

The project, based on architecture CDNA 3it would seem to count at least in one of its incarnations up to 8 Compute Die. The interesting thing is that these Compute Die will be placed above the I / O Die (two Compute Dies per I / O Die) where the memory controllers and other components will reside.

According to the indiscretion, the Compute Die will be produced in the 5 nanometer manufacturing process by TSMC and will occupy an area of ​​110 mm2, while the underlying I / O Die will be made at 6 nanometers (320-360 mm2) again by the Taiwanese manufacturing partner. The whole will be placed on a interpose di notevoli sizecirca 2750 mm2on which they will find a place up to eight HBM3 memory stacks, connected in pairs to individual I / O dies.

AMD would have designed everything to ensure that different Compute Die can be placed above the I / O Die, not only chips teeming with stream processors but possibly also solutions with more specific features to meet the needs of individual customers.

The throttle should be compatible with the interface PCI Express 5.0while in terms of consumption we speak of approx 600W, which should come as no surprise as the Instinct MI250X in the OAM format has a TDP of 560W. At the moment it is not known when AMD will introduce MI300 solutions based on CDNA 3 architecture but, according to the past, it could already do so towards the end of this year or at the latest in early 2023.